<?xml version="1.0" encoding="UTF-8"?><!DOCTYPE article  PUBLIC "-//NLM//DTD Journal Publishing DTD v3.0 20080202//EN" "http://dtd.nlm.nih.gov/publishing/3.0/journalpublishing3.dtd"><article xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" dtd-version="3.0" xml:lang="en" article-type="research article"><front><journal-meta><journal-id journal-id-type="publisher-id">MSCE</journal-id><journal-title-group><journal-title>Journal of Materials Science and Chemical Engineering</journal-title></journal-title-group><issn pub-type="epub">2327-6045</issn><publisher><publisher-name>Scientific Research Publishing</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.4236/msce.2017.51014</article-id><article-id pub-id-type="publisher-id">MSCE-73668</article-id><article-categories><subj-group subj-group-type="heading"><subject>Articles</subject></subj-group><subj-group subj-group-type="Discipline-v2"><subject>Chemistry&amp;Materials Science</subject></subj-group></article-categories><title-group><article-title>
 
 
  STEM Moir&#233; Observation of Lattice-Relaxed Germanium Grown on Silicon
 
</article-title></title-group><contrib-group><contrib contrib-type="author" xlink:type="simple"><name name-style="western"><surname>Junji</surname><given-names>Yamanaka</given-names></name><xref ref-type="aff" rid="aff1"><sup>1</sup></xref></contrib><contrib contrib-type="author" xlink:type="simple"><name name-style="western"><surname>Chiaya</surname><given-names>Yamamoto</given-names></name><xref ref-type="aff" rid="aff2"><sup>2</sup></xref></contrib><contrib contrib-type="author" xlink:type="simple"><name name-style="western"><surname>Hiroki</surname><given-names>Nakaie</given-names></name><xref ref-type="aff" rid="aff1"><sup>1</sup></xref></contrib><contrib contrib-type="author" xlink:type="simple"><name name-style="western"><surname>Tetsuji</surname><given-names>Arai</given-names></name><xref ref-type="aff" rid="aff1"><sup>1</sup></xref></contrib><contrib contrib-type="author" xlink:type="simple"><name name-style="western"><surname>Keisuke</surname><given-names>Arimoto</given-names></name><xref ref-type="aff" rid="aff1"><sup>1</sup></xref></contrib><contrib contrib-type="author" xlink:type="simple"><name name-style="western"><surname>Kosuke</surname><given-names>O. Hara</given-names></name><xref ref-type="aff" rid="aff1"><sup>1</sup></xref></contrib><contrib contrib-type="author" xlink:type="simple"><name name-style="western"><surname>Kiyokazu</surname><given-names>Nakagawa</given-names></name><xref ref-type="aff" rid="aff1"><sup>1</sup></xref></contrib></contrib-group><aff id="aff2"><addr-line>Center for Creative Technology, University of Yamanashi, Kofu, Japan</addr-line></aff><aff id="aff1"><addr-line>Center for Crystal Science and Technology, University of Yamanashi, Kofu, Japan</addr-line></aff><pub-date pub-type="epub"><day>04</day><month>01</month><year>2017</year></pub-date><volume>05</volume><issue>01</issue><fpage>102</fpage><lpage>108</lpage><history><date date-type="received"><day>November</day>	<month>30,</month>	<year>2016</year></date><date date-type="rev-recd"><day>Accepted:</day>	<month>January</month>	<year>13,</year>	</date><date date-type="accepted"><day>January</day>	<month>16,</month>	<year>2017</year></date></history><permissions><copyright-statement>&#169; Copyright  2014 by authors and Scientific Research Publishing Inc. </copyright-statement><copyright-year>2014</copyright-year><license><license-p>This work is licensed under the Creative Commons Attribution International License (CC BY). http://creativecommons.org/licenses/by/4.0/</license-p></license></permissions><abstract><p>
 
 
   
   We deposited Ge films on Si substrates by molecular beam epitaxy (MBE) method. The specimens were annealed at around 750 C using microwave- plasma heating technique which we had reported before. After these pro- cesses, we carried out special scanning transmission electron microscopic (STEM) observation. The moir&#233; between the crystal lattices and the scanning lines controlled by STEM was utilized to show lattice-spacing distribution. The results exhibited that we were succeeded in forming lattice-relaxed Ge thin films. It was also recognized that this STEM moir&#233; technique is very useful to observe lattice-spacing distribution for large area with high resolution. 
  
 
</p></abstract><kwd-group><kwd>STEM Moir&#233;</kwd><kwd> Lattice Strain</kwd><kwd> Ge on Si</kwd><kwd> Plasma Heating</kwd></kwd-group></article-meta></front><body><sec id="s1"><title>1. Introduction</title><p>Ge is an attracting material for high-speed devices because of its high-carrier- mobility [<xref ref-type="bibr" rid="scirp.73668-ref1">1</xref>] [<xref ref-type="bibr" rid="scirp.73668-ref2">2</xref>] [<xref ref-type="bibr" rid="scirp.73668-ref3">3</xref>] [<xref ref-type="bibr" rid="scirp.73668-ref4">4</xref>]. A Ge film on Si substrate has many advantages compared with bulk Ge wafer when we think about future industrial application. However, it is not easy to grow low dislocation-density Ge films onto Si because of their 4% lattice mismatch [<xref ref-type="bibr" rid="scirp.73668-ref5">5</xref>] [<xref ref-type="bibr" rid="scirp.73668-ref6">6</xref>]. In order to reduce dislocation density of Ge films, post-growth annealing might be the most common method. However, it may cause interdiffusion between the Ge films and the Si substrates because the Ge-Si is an isomorphous system [<xref ref-type="bibr" rid="scirp.73668-ref7">7</xref>]. In order to overcome this issue, we applied a new rapid heating technique proposed by our group and succeeded in forming Ge thin films on Si substrates [<xref ref-type="bibr" rid="scirp.73668-ref8">8</xref>] [<xref ref-type="bibr" rid="scirp.73668-ref9">9</xref>] [<xref ref-type="bibr" rid="scirp.73668-ref10">10</xref>].</p><p>From the other viewpoint, it is important to study lattice strains or lattice- space distributions of semiconductors because they are strongly affected electric properties. Recently other researchers discovered that the moir&#233; fringes between semiconductor lattices and scanning lines produced by STEM could be used to analyze distributions of lattice strains [<xref ref-type="bibr" rid="scirp.73668-ref11">11</xref>]-[<xref ref-type="bibr" rid="scirp.73668-ref17">17</xref>].</p><p>In this study we applied this quite new technique to our specimen (Ge/Si) and it was evaluated that we were succeeded in forming Ge films with no strains all over the specimen.</p></sec><sec id="s2"><title>2. Experimental Procedure</title><sec id="s2_1"><title>2.1. MBE Growth and Plasma Heating</title><p>We prepared the specimens using same procedure which has been published [<xref ref-type="bibr" rid="scirp.73668-ref10">10</xref>]. Therefore only important part of the Ge film growth and plasma heating will be shown in this paper. Ge films with 300 nm-thick were epitaxially grown onto the Si (100) substrate by MBE. The substrate temperature was 300 C. Then 150 nm-thick SiO<sub>2</sub> was deposited onto the Ge/Si at 300 C by plasma CVD as a barrier against W diffusion into the Ge. After that, 100 nm-thick W was deposited onto the SiO<sub>2</sub>/Ge/Si at room temperature by RF-sputtering as a heat source of the plasma heating. Then we set the specimen in the microwave-hydrogen- plasma heating chamber and heated the specimen up to 700 C. It took less than 2 seconds that the temperature reached to 700 C from the room temperature. Just after the specimen-temperature reached to 700 C, we shut down the plasm power and it took about 10 seconds that the specimen-temperature decreased to room temperature.</p></sec><sec id="s2_2"><title>2.2. STEM Moir&#233; Observation</title><p>We deposited protection layers onto the annealed specimen to avoid damages caused by focused ion beam (FIB). First, we deposited an amorphous carbon onto the W/SiO<sub>2</sub>/Ge/Si by simple vacuum evaporation. Second, Pt-Pd alloy was deposited onto the C/W/SiO<sub>2</sub>/Ge/Si by magnetron sputtering. Then the specimen was set into the FIB and W was deposited onto the Pt-Pd/C/W/SiO<sub>2</sub>/Ge/Si by ion-assisted chemical deposition in the FIB chamber. After preparing these protection layers, the specimen was fabricated by FIB (Hitachi FB-2100A). Then we checked the microstructure of the specimen using conventional TEM and STEM methods. After that, we set up the STEM condition carefully and took high-resolution STEM images and STEM moir&#233; with the acceleration voltage of 200 kV. We mainly used field-emission type STEM (FEI, Tecnai Osiris). The STEM is not a Cs corrected microscope so it is almost impossible to take atomic-resolution STEM images but it has enough potential to take crystal-lattice- resolution STEM images. Therefore this STEM is suitable for our purpose to take STEM moir&#233; fringes.</p><p><xref ref-type="fig" rid="fig1">Figure 1</xref> is a schematic illustration of the STEM moir&#233; pattern. STEM moir&#233; is a kind of fringe between the crystal-lattice spacing and the electron-beam scanning lines. In this study, we focused on the Ge and Si (111) planes and we set the scanning-line period to 632 pm.</p><fig id="fig1"  position="float"><label><xref ref-type="fig" rid="fig1">Figure 1</xref></label><caption><title> An schematic illustration of the STEM moir&#233; pattern, interaction between the STEM scanning lines and the crystal lattices</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/73668x2.png"/></fig></sec></sec><sec id="s3"><title>3. Results and Discussion</title><p><xref ref-type="fig" rid="fig2">Figure 2</xref> and <xref ref-type="fig" rid="fig3">Figure 3</xref> are results of overall STEM observations. The bright field STEM image (<xref ref-type="fig" rid="fig2">Figure 2</xref>) shows that the dislocation density of this Ge film is low even though there are 4% lattice mismatch between the Si substrate. The Si there and the high-angle-annular-dark-filed (HAADF) STEM image (<xref ref-type="fig" rid="fig3">Figure 3</xref>) suggests that the Ge film is compositionally uniform.</p><p>The bright field STEM image (<xref ref-type="fig" rid="fig2">Figure 2</xref>) shows that the dislocation density of this Ge film is low even though there are 4% lattice mismatch between the Si substrate. The Si there and the high-angle-annular-dark-filed (HAADF) STEM image (<xref ref-type="fig" rid="fig3">Figure 3</xref>) suggests that the Ge film is compositionally uniform. <xref ref-type="fig" rid="fig4">Figure 4</xref> is a high-resolution HAADF-STEM image of the Ge part which is located just on the Si substrate. This high-resolution image suggests that the Ge lattice is not strained even on the Si substrate. However, high-resolution TEM and STEM images can not cover micrometer order wide area in general. This is one of the weak point of TEM and STEM.</p><p>In order to overcome this weak point and to analyze the lattice spacing distribution, we carried out a quite new STEM technique proposed by other researchers [<xref ref-type="bibr" rid="scirp.73668-ref11">11</xref>]-[<xref ref-type="bibr" rid="scirp.73668-ref17">17</xref>]. <xref ref-type="fig" rid="fig5">Figure 5</xref> is a schematic illustration how to take a STEM moir&#233; pattern. In this work, we tried to take two different STEM moir&#233; patterns simultaneously: 1) moir&#233; pattern between Ge (111) planes and STEM scanning lines and 2) moir&#233; pattern between Si (111) planes and STEM scanning lines. Therefore, we set the STEM scan direction almost parallel to but not exactly parallel to (111) planes. Figures 6-8 are STEM moir&#233; patterns taken from the annealed specimen. <xref ref-type="fig" rid="fig6">Figure 6</xref> is the original data which we did not do any contrast/ brightness modification. In the case of <xref ref-type="fig" rid="fig7">Figure 7</xref> and <xref ref-type="fig" rid="fig8">Figure 8</xref>, the image contrast was adjusted for Si area and Ge area, respectively. These data include two important information. First, the directions and spacing or the STEM moir&#233; patterns in Ge area and Si area are drastically changed across the Ge/Si interface. This is because of the 4% lattice mismatch between Ge and Si. Second, the STEM moir&#233; pattern in Ge area is not bending at all. This means that the Ge (111) lattice planes keep same direction and same spacing at least inside the observed are. The observed are was submicron squared, so it is assumed that the Ge film is not strained all over the specimen.</p><fig id="fig2"  position="float"><label><xref ref-type="fig" rid="fig2">Figure 2</xref></label><caption><title> Low magnification STEM bright field image. There exist some dislocations but the dislocation density is not so high</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/73668x3.png"/></fig><fig id="fig3"  position="float"><label><xref ref-type="fig" rid="fig3">Figure 3</xref></label><caption><title> Low magnification STEM HAADF image. It is clear that the Ge film is compositionally uniform</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/73668x4.png"/></fig><fig id="fig4"  position="float"><label><xref ref-type="fig" rid="fig4">Figure 4</xref></label><caption><title> A high-resolution HAADF-STEM image of the Ge part</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/73668x5.png"/></fig><fig id="fig5"  position="float"><label><xref ref-type="fig" rid="fig5">Figure 5</xref></label><caption><title> A schematic illustration how to take a STEM moir&#233; pattern. The STEM scan direction is almost parallel to (111) planes but it is not exactly parallel to them</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/73668x6.png"/></fig><fig id="fig6"  position="float"><label><xref ref-type="fig" rid="fig6">Figure 6</xref></label><caption><title> A STEM moir&#233; patterns pattern taken from the annealed specimen. This micrograph is the original one which we did not do any contrast/brightness modification. In <xref ref-type="fig" rid="fig7">Figure 7</xref> and <xref ref-type="fig" rid="fig8">Figure 8</xref>, modified micrographs are shown</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/73668x7.png"/></fig><fig id="fig7"  position="float"><label><xref ref-type="fig" rid="fig7">Figure 7</xref></label><caption><title> A STEM moir&#233; patterns pattern taken from the annealed specimen. Contrast and brightness were adjusted for Si are. The original micrograph is shown in <xref ref-type="fig" rid="fig6">Figure 6</xref>. The other modified micrograph is shown in <xref ref-type="fig" rid="fig8">Figure 8</xref></title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/73668x8.png"/></fig><fig id="fig8"  position="float"><label><xref ref-type="fig" rid="fig8">Figure 8</xref></label><caption><title> A STEM moir&#233; patterns pattern taken from the annealed specimen. Contrast and brightness were adjusted for Ge are. The original micrograph is shown in <xref ref-type="fig" rid="fig6">Figure 6</xref>. The other modified micrograph is shown in <xref ref-type="fig" rid="fig7">Figure 7</xref></title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/73668x9.png"/></fig></sec><sec id="s4"><title>4. Summary</title><p>In this study, we produced a low-dislocation-density Ge thin film onto Si substrate by MBE followed by microwave-hydrogen plasma heating. We precisely analyze the lattice-space distribution by using STEM moir&#233; pattern and it is proved that the Ge film is not strained. This means that we are succeeded in forming a completely relaxed uniform Ge thin film on the Si, and the film has good crystallinity. It was also shown that the STEM moir&#233; pattern is very useful to investigate the lattice-space distributions.</p></sec><sec id="s5"><title>Acknowledgements</title><p>The authors thank Dr. Yukihito Kondo and Dr. Noriaki Endo of JEOL Ltd. for useful suggestions. We also thank Dr. Kazuo Ishizuka, Dr. Akimitsu Ishizuka, and Dr. Hirofumi Matsuhata of HREM Research Inc. for their kind comments.</p></sec><sec id="s6"><title>Cite this paper</title><p>Yamanaka, J., Yamamoto, C., Nakaie, H., Arai, T., Arimoto, K., Hara, K.O. and Nakagawa, K. (2017) STEM Moir&#233; Observation of Lattice-Relaxed Germanium Grown on Silicon. Journal of Materials Science and Chemical Engineering, 5, 102-108. http://dx.doi.org/10.4236/msce.2017.51014</p></sec></body><back><ref-list><title>References</title><ref id="scirp.73668-ref1"><label>1</label><mixed-citation publication-type="other" xlink:type="simple">Lee, C.H., Nishimura, T., Tabata, T., Wang, S.K., Nagashio, K., Kita, K. and Toriumi, A. (2010) Ge MOSFETs Performance: Impact of Ge Interface Passivation. 2010 IEEE International Electron Devices Meeting (IEDM), 18-1.  
https://doi.org/10.1109/iedm.2010.5703384</mixed-citation></ref><ref id="scirp.73668-ref2"><label>2</label><mixed-citation publication-type="other" xlink:type="simple">Maeda, T., Ikeda, K., Nakaharai, S., Tezuka, T., Sugiyama, N., Moriyama, Y. and Takagi, S. (2006) Thin-Body Ge-on-Insulator p-Channel MOSFETs with Pt Germanide Metal Source/Drain. Thin Solid Films, 508, 346-350.  
https://doi.org/10.1016/j.tsf.2005.07.339</mixed-citation></ref><ref id="scirp.73668-ref3"><label>3</label><mixed-citation publication-type="other" xlink:type="simple">Kamata, Y. (2008) High-k/Ge MOSFETs for Future Nanoelectronics. Materials Today, 11, 30-38. https://doi.org/10.1016/S1369-7021(07)70350-4</mixed-citation></ref><ref id="scirp.73668-ref4"><label>4</label><mixed-citation publication-type="other" xlink:type="simple">Lee, M.L., Leitz, C.W., Cheng, Z., Antoniadis, D.A. and Fitzgerald, E.A. (2002) Strained Ge Channel p-Type Metal-Oxide-Semiconductor Field-Effect Transistors Grown on Sia a xGex/Sivirtual Substrates.</mixed-citation></ref><ref id="scirp.73668-ref5"><label>5</label><mixed-citation publication-type="other" xlink:type="simple">Luan, H.C., Lim, D.R., Lee, K.K., Chen, K.M., Sandland, J.G., Wada, K. and Kimerling, L.C. (1999) High-Quality Ge Epilayers on Si with Low Threading-Dislocation Densities. Applied Physics Letters, 75, 2909-2911. https://doi.org/10.1063/1.125187</mixed-citation></ref><ref id="scirp.73668-ref6"><label>6</label><mixed-citation publication-type="other" xlink:type="simple">Currie, M.T., Samavedam, S.B., Langdo, T.A., Leitz, C.W. and Fitzgerald, E.A. (1998) Con-trolling Threading Dislocation Densities in Ge on Si Using Graded SiGe Layers and Chemical-Mechanical Polishing. Applied Physics Letters, 72, 1718-1720.  
https://doi.org/10.1063/1.121162</mixed-citation></ref><ref id="scirp.73668-ref7"><label>7</label><mixed-citation publication-type="other" xlink:type="simple">Massalski, T.B., Okamoto, H., Subramanian, P.R. and Kacprzak, L. (1990) Binary Alloy Phase Diagrams. 2nd Edition, ASM International.</mixed-citation></ref><ref id="scirp.73668-ref8"><label>8</label><mixed-citation publication-type="other" xlink:type="simple">Kondo, Y. and Endo, N. (2014) Strain Analysis Using STEM Moiré Method. Kenbikyo, 49, 226. (In Japanese)</mixed-citation></ref><ref id="scirp.73668-ref9"><label>9</label><mixed-citation publication-type="other" xlink:type="simple">Kim, S., Lee, S., Kondo, Y., Lee, K., Byun, G., Lee, S. and Lee, K. (2013) Journal of Applied Physics, 114, Article ID: 053518. https://doi.org/10.1063/1.4817729</mixed-citation></ref><ref id="scirp.73668-ref10"><label>10</label><mixed-citation publication-type="other" xlink:type="simple">Kim, S., Lee, S., Oshima, Y., Kondo, Y., Lee, H., Lee, K., Kim, S., Lee, S., Oshima, Y., Kondo, Y., Lee, H. and Lee, K. (2014).</mixed-citation></ref><ref id="scirp.73668-ref11"><label>11</label><mixed-citation publication-type="other" xlink:type="simple">Kim, S., Kondo, Y., Lee, K., Byun, G., Kim, J.J., Lee, S. and Lee, K. (2013) Quantitative Measurement of Strain Field in Strained-Channel-Transistor Arrays by Scanning Moiré Fringe Imaging. Appl. Phys. Lett., 103, Article ID: 033523.  
https://doi.org/10.1063/1.4816286</mixed-citation></ref><ref id="scirp.73668-ref12"><label>12</label><mixed-citation publication-type="other" xlink:type="simple">Kim, S., Kim, J.J., Jung, Y., Lee, K., Byun, G., Hwang, K.H., Lee, S. and Lee, K. (2013) Reliable Strain Measurement in Transistor Arrays by Robust Scanning Transmission Electron Microscopy. AIP Advances, 3, Article ID: 092110.  
https://doi.org/10.1063/1.4821278</mixed-citation></ref><ref id="scirp.73668-ref13"><label>13</label><mixed-citation publication-type="other" xlink:type="simple">Kim, S., Lee, S., Oshima, Y., Kondo, Y., Okunishi, E., Endo, N., Jung, J., Byun, G., Lee, S. and Lee, K. (2013) Scanning Moiré Fringe Imaging for Quantitative Strain Mapping in Semiconductor Devices. Applied Physics Letters, 102, Article ID: 161604.  
https://doi.org/10.1063/1.4803087</mixed-citation></ref><ref id="scirp.73668-ref14"><label>14</label><mixed-citation publication-type="other" xlink:type="simple">Su, D. and Zhu, Y. (2010) Scanning Moiré Fringe Imaging by Scanning Transmission Electron Microscopy. Ultramicroscopy, 110, 229-233.  
https://doi.org/10.1016/j.ultramic.2009.11.015</mixed-citation></ref><ref id="scirp.73668-ref15"><label>15</label><mixed-citation publication-type="other" xlink:type="simple">Nakaie, H., Arai, T., Yamamoto, C., Arimoto, K., Yamanaka, J., Nakagawa, K. and Takamatsu, T. Reduction of dislocation Densities of Ge Layers Grown on Sisubstrates by Using Microwave Plasma Heating and Fabrication of High Hole Mobility MOSFETs on Ge Layers. Journal of Materials Science and Chemical Engineering. (To Be Published)</mixed-citation></ref><ref id="scirp.73668-ref16"><label>16</label><mixed-citation publication-type="other" xlink:type="simple">Arai, T., Kamimura, K., Yamamoto, C., Shirakura, M., Arimoto, K., Yamanaka, J., Nakagawa, K., Takamatsu, T., Ogino, M., Tachioka, M. and Nakazawa, H. (2017) Ohmic Contact Formation for n+ 4H-SiC Substrate by Selective Heating Method Using Hydrogen Radical Irradiation. Journal of Materials Science and Chemical Engineering, 5, 35-41. https://doi.org/10.4236/msce.2017.51005</mixed-citation></ref><ref id="scirp.73668-ref17"><label>17</label><mixed-citation publication-type="other" xlink:type="simple">Arai, T., Nakaie, H., Kamimura, K., Nakamura, H., Ariizumi, S., Ashizawa, S. and Takamatsu, T. (2016) Selective Heating of Transition Metal Using Hydrogen Plasma and Its Application to Formation of Nickel Silicide Electrodes for Silicon Ultralarge-Scale Integration Devices. Journal of Materials Science and Chemical Engineering, 4, 29. https://doi.org/10.4236/msce.2016.41006</mixed-citation></ref></ref-list></back></article>