<?xml version="1.0" encoding="UTF-8"?><!DOCTYPE article  PUBLIC "-//NLM//DTD Journal Publishing DTD v3.0 20080202//EN" "http://dtd.nlm.nih.gov/publishing/3.0/journalpublishing3.dtd"><article xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" dtd-version="3.0" xml:lang="en" article-type="research article"><front><journal-meta><journal-id journal-id-type="publisher-id">CS</journal-id><journal-title-group><journal-title>Circuits and Systems</journal-title></journal-title-group><issn pub-type="epub">2153-1285</issn><publisher><publisher-name>Scientific Research Publishing</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.4236/cs.2016.72007</article-id><article-id pub-id-type="publisher-id">CS-63647</article-id><article-categories><subj-group subj-group-type="heading"><subject>Articles</subject></subj-group><subj-group subj-group-type="Discipline-v2"><subject>Computer Science&amp;Communications</subject><subject> Engineering</subject><subject> Physics&amp;Mathematics</subject></subj-group></article-categories><title-group><article-title>
 
 
  The Design of Ultra-Low Power Adder Cell in 90 and 180 nm CMOS Technology
 
</article-title></title-group><contrib-group><contrib contrib-type="author" xlink:type="simple"><name name-style="western"><surname>asoud</surname><given-names>Sabaghi</given-names></name><xref ref-type="aff" rid="aff1"><sup>1</sup></xref><xref ref-type="corresp" rid="cor1"><sup>*</sup></xref></contrib><contrib contrib-type="author" xlink:type="simple"><name name-style="western"><surname>Saeid</surname><given-names>Marjani</given-names></name><xref ref-type="aff" rid="aff2"><sup>2</sup></xref></contrib><contrib contrib-type="author" xlink:type="simple"><name name-style="western"><surname>Abbas</surname><given-names>Majdabadi</given-names></name><xref ref-type="aff" rid="aff1"><sup>1</sup></xref></contrib></contrib-group><aff id="aff2"><addr-line>Department of Electrical Engineering, Ferdowsi University of Mashhad, Mashhad, Iran</addr-line></aff><aff id="aff1"><addr-line>Laser and Optics Research School, Nuclear Science and Technology Research School, Atomic Energy Organization of Iran, Tehran, Iran</addr-line></aff><author-notes><corresp id="cor1">* E-mail:<email>msabaghi@aeoi.org.ir(AS)</email>;</corresp></author-notes><pub-date pub-type="epub"><day>17</day><month>02</month><year>2016</year></pub-date><volume>07</volume><issue>02</issue><fpage>58</fpage><lpage>67</lpage><history><date date-type="received"><day>12</day>	<month>January</month>	<year>2016</year></date><date date-type="rev-recd"><day>accepted</day>	<month>20</month>	<year>February</year>	</date><date date-type="accepted"><day>23</day>	<month>February</month>	<year>2016</year></date></history><permissions><copyright-statement>&#169; Copyright  2014 by authors and Scientific Research Publishing Inc. </copyright-statement><copyright-year>2014</copyright-year><license><license-p>This work is licensed under the Creative Commons Attribution International License (CC BY). http://creativecommons.org/licenses/by/4.0/</license-p></license></permissions><abstract><p>
 
 
  In this paper, an ultra-low power adder cell is proposed. With cascading two XNOR cells, the sum of two inputs is achieved. Regarding to advantages of m-GDI XNOR cell, we constructed the adder cell based on this architecture. The simulation results show that the power consumption of the adder cell designed with GDI technology is 12.993 μw, whereas for this cell designed with m-GDI technology is 4.1628 μw, which both are designed at 0.18 um technology. Moreover, simulation results in 90 nm CMOS technology for m-GDI adder cell show average power consumption of 0.90262 μw and 6.3222 μw in 200 MHz and 2GHz, respectively.
 
</p></abstract><kwd-group><kwd>Adder Cell</kwd><kwd> Gate-Diffusion-Input (GDI)</kwd><kwd> Bit-Serial Adder</kwd></kwd-group></article-meta></front><body><sec id="s1"><title>1. Introduction</title><p>The adders are the most common arithmetic circuits in digital systems as key components of multipliers and dividers that are used to do subtraction. There are several types of adders with different configurations, speeds and areas that we can select an appropriate one which satisfies our requirements. When information transferring is serial to reduce wiring, the serial adders are generally used [<xref ref-type="bibr" rid="scirp.63647-ref1">1</xref>] -[<xref ref-type="bibr" rid="scirp.63647-ref3">3</xref>] . The adder is one section of comparator (digital-comparator) [<xref ref-type="bibr" rid="scirp.63647-ref4">4</xref>] - [<xref ref-type="bibr" rid="scirp.63647-ref6">6</xref>] and successive approximation ADC control system [<xref ref-type="bibr" rid="scirp.63647-ref7">7</xref>] [<xref ref-type="bibr" rid="scirp.63647-ref8">8</xref>] . Also, the adder implements the delta-sigma analog to digital converter (decimation filter) [<xref ref-type="bibr" rid="scirp.63647-ref9">9</xref>] - [<xref ref-type="bibr" rid="scirp.63647-ref12">12</xref>] . Analog adder circuit is one of important sections in phase locked loop that is used in the cavity to maintain the mode locking conditions for lasers [<xref ref-type="bibr" rid="scirp.63647-ref13">13</xref>] - [<xref ref-type="bibr" rid="scirp.63647-ref22">22</xref>] and VCSELs [<xref ref-type="bibr" rid="scirp.63647-ref23">23</xref>] - [<xref ref-type="bibr" rid="scirp.63647-ref35">35</xref>] .</p><p>The design of a 4-bit serial adder in 90 nm technology and supply voltage of 1.2 V is the goal of this paper. At first, the most important step of designing is choosing an adder cell which meets our requirements. Ideally, we have to use a full adder with minimum transistors in order to consume little power and occupy minimum space on the die. During the last years in the worldwide market, the increase in the demand of complex mobile systems led the designers to take into account a novel objective in the design of complex digital circuits including the minimization of power consumption. One of the most important reasons that fuel the need for an ultra-low power design is the high diffusion of systems such as laptop, cellular phones, wireless modems and portable multimedia applications. Also, the need for minimization of power dissipation of a system is enforced by some thermal considerations like a large percentage of the energy demanded by a device from the power supply which is converted into heat. In this way, the heat dissipation system and cooling mechanisms become indispensable for the correct, reliable and safe operation of the device. An increase of 10˚C in the working temperature of an electronic device causes a 100% increase in its failure rate. Therefore, it is possible to reduce the associated costs for expensive cooling and complex packaging needs if it is possible to decrease the heat dissipation.</p><p>The registers are other undividable parts of serial adders that consist of the latches. The cascading D Flip- flops is the simplest way to build the registers. We can achieve this register by cascading 4 D Flip-Flops since our design goal is a 4-bit adder. Choosing of proper D Flip-Flops is of our interests that beside high reliability, meet our requirements of lower power consumption and high speed. Finally, post-layout simulation will be accomplished to bring parasitic capacitances existing in the die to account. The paper is organized as follows: Section 2 briefly describes the serial adder, Section 3 provides the details of the proposed ultra-low power full adders, and Section 4 presents the results and discussions. Finally, in Section 5, we conclude.</p></sec><sec id="s2"><title>2. Serial Adder</title><p>A serial adder operates similarly to manual addition. The serial adder, at each step, calculates the sum and carries at one bit position. It starts at the least significant bit position and each successive next step it sequentially moves to the next more significant bit position where it calculates the sum and carry. At the n-th step, it calculates the sum and carries at the most significant bit position. In other words, the serial adder serially adds augend X and addend Y by adding xi, yi, and c<sub>i </sub>at the i-th bit position from i = 0 to n − 1. We have sum bit <inline-formula><inline-graphic xlink:href="http://html.scirp.org/file/3-7600422x7.png" xlink:type="simple"/></inline-formula> and carry to the next higher bit position</p><disp-formula id="scirp.63647-formula428"><graphic  xlink:href="http://html.scirp.org/file/3-7600422x8.png"  xlink:type="simple"/></disp-formula><p>where “・” is AND, “˅” is OR, and “&#197;” is XOR, and henceforth, “・” will be omitted. This serial addition can be realized by the logic network, called a serial adder, or bit-serial adder. The addition of each i-th bit is done at a rate of one bit per cycle of clock, producing sum bits, si’s, at the same rate, from the least significant bit to the most significant one. In each cycle, s<sub>i</sub> and c<sub>i</sub><sub>+1</sub>, are calculated from x<sub>i</sub>, y<sub>i</sub>, and the carry from the previous cycle, c<sub>i</sub>. The core logic network, shown in the rectangle in <xref ref-type="fig" rid="fig1">Figure 1</xref>, for this one-bit addition for the i-th bit position is called a full adder (FA).</p><p>The 1-Bit full adder design is one of the most critical components of a processor that determines its throughput, as it is used in ALU, the floating point unit, and address generation in case of cache or memory accesses. The logic symbol and truth table for a full adder circuit are shown in <xref ref-type="fig" rid="fig2">Figure 2</xref>. The logic functions for the sum and carry outputs can be written as:</p><fig id="fig1"  position="float"><label><xref ref-type="fig" rid="fig1">Figure 1</xref></label><caption><title> A serial adder</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x9.png"/></fig><fig id="fig2"  position="float"><label><xref ref-type="fig" rid="fig2">Figure 2</xref></label><caption><title> The logic symbol and truth table for a full adder</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x10.png"/></fig><disp-formula id="scirp.63647-formula429"><label>(1)</label><graphic position="anchor" xlink:href="http://html.scirp.org/file/3-7600422x11.png"  xlink:type="simple"/></disp-formula><disp-formula id="scirp.63647-formula430"><label>. (2)</label><graphic position="anchor" xlink:href="http://html.scirp.org/file/3-7600422x12.png"  xlink:type="simple"/></disp-formula><p>We obtain the logic network for a FA shown in <xref ref-type="fig" rid="fig3">Figure 3</xref> using AND, OR, and XOR gates. A D-type flip-flop may be used as a delay element which stores the carry for a cycle [<xref ref-type="bibr" rid="scirp.63647-ref3">3</xref>] . We can obtain this cell using conventional CMOS logics, but it highly suffers from large number of transistors and therefore high power consumption, large occupied are. As a results other structures, with less transistors are proposed.</p></sec><sec id="s3"><title>3. The Proposed Ultra-Low Power Full Adders</title><sec id="s3_1"><title>3.1. 8 Transistors (8-T) Full Adder</title><p>As shown in <xref ref-type="fig" rid="fig4">Figure 4</xref>, the 8-T full adder contains three modules-two 3-T XOR gates and a 2-transistor multiplexer (2-T MUX). Owing to the appealing traits of a small number of transistors and a mere 2-transistor (2-T) delay, it can work at high speed with low power dissipation.</p></sec><sec id="s3_2"><title>3.2. 10 Transistors (10-T) Full Adder</title><p>The 10-T full adder consists of four modules, including one 3-T XOR gate, one 3-T XNOR gate, and two 2-T multiplexers (2-T MUX) as shown in <xref ref-type="fig" rid="fig5">Figure 5</xref>. According to the logic equations and the GDI XOR and XNOR gates, full adders can be redesigned in two patterns including GDI XOR full adder and GDI XNOR full adder. Compared to the 8-T full adder, the GDI adders may be slightly slower, since more transistors are used in GDI circuits. As is well known, the number of transistors in circuits can influence performance in many aspects, especially speed.</p></sec><sec id="s3_3"><title>3.3. GDI (Gate-Diffusion-Input) XOR Full Adder</title><p>The transistor level implementation of GDI XOR full adder is shown in <xref ref-type="fig" rid="fig6">Figure 6</xref>. This full adder consists of three modules-two GDI XOR gates and a multiplexer. In the worst case, Sum has 4-T delay while Cout has 3-T delay. However, due to the advantages of GDI cell, this circuit still can achieve its benefit of low power consumption [<xref ref-type="bibr" rid="scirp.63647-ref36">36</xref>] - [<xref ref-type="bibr" rid="scirp.63647-ref38">38</xref>] .</p><p><xref ref-type="fig" rid="fig7">Figure 7</xref> shows the GDI XNOR full adder which is another basic architecture of the application of GDI cells. This scheme also includes three modules. It contains two GDI XNOR gates and a multiplexer. In the worst route, Sum has 4-T delay and Cout has 3-T delay [<xref ref-type="bibr" rid="scirp.63647-ref39">39</xref>] . The other new leaf cells and the circuits built on the basis of GDI technique is presented by P. Balasubramanian et al. and is called m-GDI technique [<xref ref-type="bibr" rid="scirp.63647-ref36">36</xref>] . The structure of a XNOR m-GDI cell is shown in <xref ref-type="fig" rid="fig8">Figure 8</xref>.</p></sec><sec id="s3_4"><title>3.4. The Proposed Adder Cell</title><p>With cascading two XNOR cells we can achieve the sum of two inputs, regarding to advantages of m-GDI XNOR cell, we constructed the adder cell based on this architecture. The output carry can be resulted of a GDI cell shown in <xref ref-type="fig" rid="fig9">Figure 9</xref>. The simulations show low high to low speed of carry out when input A is high, input B is low and carry in is low. A restoration PMOS is used to implement the carry out.</p><fig id="fig3"  position="float"><label><xref ref-type="fig" rid="fig3">Figure 3</xref></label><caption><title> The logic network for a full adder</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x13.png"/></fig><fig id="fig4"  position="float"><label><xref ref-type="fig" rid="fig4">Figure 4</xref></label><caption><title> The 8 transistors full adder</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x14.png"/></fig><fig id="fig5"  position="float"><label><xref ref-type="fig" rid="fig5">Figure 5</xref></label><caption><title> The 10 transistors full adder</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x15.png"/></fig><fig id="fig6"  position="float"><label><xref ref-type="fig" rid="fig6">Figure 6</xref></label><caption><title> The GDI XOR full adder</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x16.png"/></fig><fig id="fig7"  position="float"><label><xref ref-type="fig" rid="fig7">Figure 7</xref></label><caption><title> The GDI XNOR full adder</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x17.png"/></fig><fig id="fig8"  position="float"><label><xref ref-type="fig" rid="fig8">Figure 8</xref></label><caption><title> The m-GDI XNOR cell</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x18.png"/></fig><fig id="fig9"  position="float"><label><xref ref-type="fig" rid="fig9">Figure 9</xref></label><caption><title> The proposed adder cell</title></caption><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x19.png"/></fig></sec></sec><sec id="s4"><title>4. Results and Discussions</title><p>The input/output waveforms of GDI XNOR and m-GDI XNOR cells in 180 nm technology and supply voltage 0f 1.8 v are illustrated in <xref ref-type="fig" rid="fig1">Figure 1</xref>0. The m-GDI XNOR has better swing, lower power consumption and higher speed. <xref ref-type="table" rid="table1">Table 1</xref> indicates lower power consumption and higher speed of m-GDI XNOR cell in comparison with GDI XNOR cell.</p><p>The power consumption of the adder cell designed with GDI technology is 12.993 &#181;w, whereas for this cell designed with m-GDI technology is 4.1628 &#181;w (both are designed at 0.18 um technology and shown inputs). HSPICE simulations of two structures are illustrated and compared in <xref ref-type="fig" rid="fig1">Figure 1</xref>1.</p><p>The input/output waveform of a m-GDI adder cell, with restoration PMOS, in 90 nm technology is shown in <xref ref-type="fig" rid="fig1">Figure 1</xref>2. <xref ref-type="table" rid="table2">Table 2</xref> indicates average power consumption and rise/fall time of m-GDI adder cell in 90 nm technology.</p><fig-group id="fig10"><label><xref ref-type="fig" rid="fig1">Figure 1</xref>0</label><caption><title> The input/output waveforms of XNOR cells (a) GDI; (b) m-GDI.</title></caption><fig id ="fig10_1"><label>(b)</label><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x20.png"/></fig><fig id ="fig10_2"><label></label><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x21.png"/></fig></fig-group><fig-group id="fig11"><label><xref ref-type="fig" rid="fig1">Figure 1</xref>1</label><caption><title> The input/output waveforms of adder cells (a) GDI XNOR full adder; (b) m-GDI XNOR full adder, without restoration PMOS; (c) m-GDI XNOR full adder, with restoration PMOS.</title></caption><fig id ="fig11_1"><label>(b)</label><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x22.png"/></fig><fig id ="fig11_2"><label>(c)</label><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x23.png"/></fig><fig id ="fig11_3"><label></label><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x24.png"/></fig></fig-group><fig-group id="fig12"><label><xref ref-type="fig" rid="fig1">Figure 1</xref>2</label><caption><title> The m-GDI adder cell input/output waveforms in 90 nm technology (a) 200 MHz; (b) 2 GHz.</title></caption><fig id ="fig12_1"><label>(b)</label><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x25.png"/></fig><fig id ="fig12_2"><label></label><graphic mimetype="image"   position="float"  xlink:type="simple"  xlink:href="http://html.scirp.org/file/3-7600422x26.png"/></fig></fig-group><table-wrap id="table1" ><label><xref ref-type="table" rid="table1">Table 1</xref></label><caption><title> Comparison of GDI and m-GDI power consumption and delay</title></caption><table><tbody><thead><tr><th align="center" valign="middle" >XNOR cell</th><th align="center" valign="middle" >Average power (&#181;w)</th><th align="center" valign="middle" >Rise time (ps)</th><th align="center" valign="middle" >Fall time (ps)</th></tr></thead><tr><td align="center" valign="middle" >m-GDI</td><td align="center" valign="middle" >1.2796</td><td align="center" valign="middle" >50</td><td align="center" valign="middle" >148</td></tr><tr><td align="center" valign="middle" >GDI</td><td align="center" valign="middle" >3.9206</td><td align="center" valign="middle" >74</td><td align="center" valign="middle" >213</td></tr></tbody></table></table-wrap><table-wrap id="table2" ><label><xref ref-type="table" rid="table2">Table 2</xref></label><caption><title> Average power consumption and rise/fall time of m-GDI adder cell in 90 nm technology</title></caption><table><tbody><thead><tr><th align="center" valign="middle" >Frequency</th><th align="center" valign="middle" >Average vdd power consumption (&#181;w)</th><th align="center" valign="middle" >Average inputa power consumption (&#181;w)</th><th align="center" valign="middle" >Average inputb power consumption (&#181;w)</th><th align="center" valign="middle" >Average cin power consumption (&#181;w)</th><th align="center" valign="middle" >Rise time (ps)</th><th align="center" valign="middle" >Fall time (ps)</th></tr></thead><tr><td align="center" valign="middle" >200 MHz</td><td align="center" valign="middle" >0.90262</td><td align="center" valign="middle" >0.30007</td><td align="center" valign="middle" >0.17399</td><td align="center" valign="middle" >0.11401</td><td align="center" valign="middle" >57</td><td align="center" valign="middle" >75</td></tr><tr><td align="center" valign="middle" >2 GHz</td><td align="center" valign="middle" >6.3222</td><td align="center" valign="middle" >0.31976</td><td align="center" valign="middle" >0.19282</td><td align="center" valign="middle" >0.13620</td><td align="center" valign="middle" >94</td><td align="center" valign="middle" >123</td></tr></tbody></table></table-wrap></sec><sec id="s5"><title>5. Conclusion</title><p>An ultra-low power adder cell is proposed with cascading two XNOR cells. In this way, we can achieve the sum of two inputs, regarding to advantages of m-GDI XNOR cell. The simulation results show that the power consumption of the adder cell designed with GDI technology is 12.993 &#181;w, whereas for this cell designed with m-GDI technology is 4.1628 &#181;w at 0.18 &#181;m technology. Also, simulation results show average power consumption of 0.90262 &#181;w and 6.3222 &#181;w in 200 MHz and 2 GHz, respectively for m-GDI adder cell in 90 nm CMOS technology.</p></sec><sec id="s6"><title>Acknowledgements</title><p>This work was supported by the Laser and Optics Research School, Nuclear Science and Technology Research School, Atomic Energy Organization of Iran, Tehran, Iran.</p></sec><sec id="s7"><title>Cite this paper</title><p>MasoudSabaghi,SaeidMarjani,AbbasMajdabadi, (2016) The Design of Ultra-Low Power Adder Cell in 90 and 180 nm CMOS Technology. Circuits and Systems,07,58-67. doi: 10.4236/cs.2016.72007</p></sec><sec id="s8"><title>NOTES</title></sec></body><back><ref-list><title>References</title><ref id="scirp.63647-ref1"><label>1</label><mixed-citation publication-type="other" xlink:type="simple">Chen, W. (2007) The VLSI Handbook. CRC Press, FL, USA.</mixed-citation></ref><ref id="scirp.63647-ref2"><label>2</label><mixed-citation publication-type="other" xlink:type="simple">Wang, D., Yang, D., Cheng, W., Guan, X., Shu, X. and Yang, Y. (2009) Novel Low Power Full Adder Cells in 180 nm CMOS Technology. The IEEE Conference on Industrial Electronics and Applications (ICIEA), Xi’an, China, 25-27 May 2009, 25-27.</mixed-citation></ref><ref id="scirp.63647-ref3"><label>3</label><mixed-citation publication-type="other" xlink:type="simple">Gao, H., Qiao, F., Wei, D. and Yang, H. (2006) A Novel Low-Power and High-Speed Master-Slave D Flip-Flop. 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(2015) An Optimized Opamp-Sharing in 2nd Order ΔΣ Modulator Based on Changing the Stages Output Capacitance Timing Strategy. The Progress in Electromagnetics Research Symposium (PIERS), Prague, Czech Republic, 6-9 July 2015, 827-830.</mixed-citation></ref><ref id="scirp.63647-ref11"><label>11</label><mixed-citation publication-type="other" xlink:type="simple">Dashtbayazi, M., Majdabadi, A., Sabaghi, M. and Marjani, S. (2015) An Optimized Opamp-Sharing Technique in 2nd Order Delta-Sigma Modulator Based on Changing the Stages Output Capacitance Timing Strategy. The Iranian Conference on Optics and Laser Engineering (ICOLE), Isfahan, 2-3 September 2015, 129-131.</mixed-citation></ref><ref id="scirp.63647-ref12"><label>12</label><mixed-citation publication-type="other" xlink:type="simple">Dashtbayazi, M., Marjani, S., Sabaghi, M. and Majdabadi, A. (2016) Changing the Clock Pulse-Width Dedicated to Stages Strategy for Opamp-Sharing Technique in 2nd Order High-Pass Delta-Sigma Modulators. The International Conference on Electrical, Computer, Mechanical and Mechatronics Engineering (ICE), Dubai, United Arab Emirates, to Be Published.</mixed-citation></ref><ref id="scirp.63647-ref13"><label>13</label><mixed-citation publication-type="other" xlink:type="simple">Marjani, A., Marjani, S. and Shirazian, S. (2011) Numerical Simulation of Silicon Carbide Polymers (6H-SiC &amp; 3C-SiC) as the Active Area for 0.83 μm Wavelength Semiconductor Laser. The 14th Iranian Physical Chemistry Conference, University of Tehran, Kish, 25-28 February 2011, 876-878.</mixed-citation></ref><ref id="scirp.63647-ref14"><label>14</label><mixed-citation publication-type="other" xlink:type="simple">Marjani, S., Faez, R. and Marjani, H. (2011) Analysis and Design of Semiconductor Laser with Silicon Carbide Polymers (6H-SiC and 3C-SiC). Australian Journal of Basic and Applied Sciences, 5, 1060-1063.</mixed-citation></ref><ref id="scirp.63647-ref15"><label>15</label><mixed-citation publication-type="other" xlink:type="simple">Marjani, S. and Marjani, H. (2012) Self-Heating Effects in a Silicon Carbide Polymers (6H-SiC and 3C-SiC) Semiconductor Laser. Asian Journal of Chemistry, 24, 3145-3147.</mixed-citation></ref><ref id="scirp.63647-ref16"><label>16</label><mixed-citation publication-type="other" xlink:type="simple">Marjani, S. and Marjani, H. (2012) Effects of Lattice Temperature on the Various Elements of Heat Sources in Silicon Carbide Polymers (6H-SiC and 3C-SiC) Semiconductor Laser. Asian Journal of Chemistry, 24, 3123-3125.</mixed-citation></ref><ref id="scirp.63647-ref17"><label>17</label><mixed-citation publication-type="other" xlink:type="simple">Marjani, S., Faez, R. and Marjani, H. (2012) Analysis of the Various Elements of Heat Sources in Silicon Carbide Polymers (6H-SiC and 3C-SiC) Semiconductor Laser. Asian Journal of Chemistry, 24, 2333-2335.</mixed-citation></ref><ref id="scirp.63647-ref18"><label>18</label><mixed-citation publication-type="other" xlink:type="simple">Marjani, S., Faez, R. and Marjani, H. (2012) Design and Modeling of a Semiconductor Laser by Employing Silicon Carbide Polymers (6H-SiC, 3C-SiC and 4H-SiC). Asian Journal of Chemistry, 24, 2177-2179.</mixed-citation></ref><ref id="scirp.63647-ref19"><label>19</label><mixed-citation publication-type="other" xlink:type="simple">Marjani, S., Faez, R. and Hosseini, S.E. (2013) Analysis of Lattice Temperature Effects on a GaInP/6H-SiC Strained Quantum-Well Lasers. Asian Journal of Chemistry, 25, 4715-4717.</mixed-citation></ref><ref id="scirp.63647-ref20"><label>20</label><mixed-citation publication-type="other" xlink:type="simple">Madadi, R., Marjani, S. and Faez, R. (2013) Silicon Carbide Polymers (6H-SiC, 3C-SiC and 4H-SiC) Semiconductor Laser: Influence of Self-Heating. 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