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K. Wang, N. R. Tao, G. Liu, J. Lu and K. Lu, “Plastic strain-Induced Grain Refinement at the Nanometer Scale in Copper,” Acta Materialia, Vol. 54, 2006, p. 5281. http://dx.doi.org/10.1016/j.actamat.2006.07.013

has been cited by the following article:

• TITLE: Mechanical Properties of Micro- and Nanostructured Copper Films

  AUTHORS: N. Kosarev, M. Khazin, R. Apakashev, N. Valiev

  KEYWORDS: Nano- and Microcrystalline Materials; Hall-Petch Relation; Yield Point Stress; Grain Boundary Hardening Coefficient; Nonequilibrium Grain Boundaries

  JOURNAL NAME: Journal of Materials Science and Chemical Engineering, Vol.1 No.5, November 7, 2013

  ABSTRACT: Mechanical properties of electrodeposited and electroless copper with nano- and crystalline structure are considered. Grain diameters in films ranged from 0.06 to 8 μm. A model is described which takes into account the grain boundary hardening and density of dislocation.