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J. Qi and Y. Song, “Experimental Studies on the Diffusion Reaction of Al /Ni /Fe Interface,” Metal Materials and Metallurgy Engineering, Vol. 35, No. 6, 2007, pp. 8-11.

has been cited by the following article:

• TITLE: Study of Ni/Al Interface Diffusion by Molecular Dynamics Simulation

  AUTHORS: Chunguang Zhang, Hao Wang, Yishen Qiu

  KEYWORDS: Molecular Dynamics Simulation, Interface Diffusion, EAM Potential

  JOURNAL NAME: Engineering, Vol.3 No.3, March 7, 2011

  ABSTRACT: Molecular dynamics simulation of Ni/Al interface diffusion is carried out by Embedded Atom Method (EAM) potential. The problem how the temperature affects Ni/Al interface diffusion is discussed. The initial dynamic behavior of Ni/Al interface diffusion at high temperature is shown. The study in this letter is helpful to understand the origin of diffusion phenomenon.