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K. Hiller, M. Kuechler, D. Billep, B. Schroeter, M. Dienel, D. Scheibner and T. Gessner, “Bonding and Deep RIE: A Powerful Combination for High-Aspect-Ratio Sensors and Actuators,” Proceedings of SPIE 5715, Micromachining and Microfabrication Process Technology X, San Jose, 11 April 2005.

has been cited by the following article:

• TITLE: Towards Quantitative Characterisation of the Small Force Transducer Used in Nanoindentation Instruments

  AUTHORS: Zhi Li, Uwe Brand

  KEYWORDS: Nanometrology; Nanoindentation Instrument; Nano-Force Transducer; Microelectromechanical Systems; Nano-Force Calibration

  JOURNAL NAME: Modern Instrumentation, Vol.2 No.4, September 30, 2013

  ABSTRACT: Quantitative characterization of the mechanical properties of materials in micro-/nano-scale using depth-sensing indentation technique demands high performance of nanoindentation instruments in use. In this paper, the efforts to calibrate the capacitive force transducer of a commercial nanoindentation instrument are presented, where the quasi-static characteristic of the force transducer has been calibrated by a precise compensation balance with a resolution of ~1 nN. To investigate the dynamic response of the transducer, an electrostatic MEMS (Micro-Electro-Mechanical System) based on nano-force transfer standard with nano-Newton (10-9 Newton) resolution and a bandwidth up to 6 kHz have been employed. Preliminary experimental results indicate that 1) the force transducer under calibration has a probing force uncertainty less than 300 nN (1σ) in the calibration range of 1 mN; 2) the transient duration at contact points amounts to 10 seconds; 3) the overshoot of engagement is pre-load dependent.