Article citationsMore>>

J. Maity, T. K. Pal and R. Maiti, “Transient Liquid Phase Diffusion Bonding of 6061-15 wt% SiCp in Argon Environment,” Journal of Materials Processing Technology, Vol. 209, No. 7, 2009, pp. 3568-3580. doi:10.1016/j.jmatprotec.2008.08.015

has been cited by the following article:

SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top