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A. Rohatgi, S. K. Vecchio and T. G. Gray III, “The Influence of Stacking Fault Energy on the Mechanical Behavior of Cu and Cu-Al Alloys: Deformation Twinning, Work Hardening, and Dynamic Recovery,” Metallurgical and Materials Transactions A, Vol. 32, No. 1, 2001, pp. 135-145. doi:10.1007/s11661-001-0109-7

has been cited by the following article:

• TITLE: Microstructural Evolution in Cu-Mg Alloy Processed by Conform

  AUTHORS: Lianpeng Song, Yuan Yuan, Zhimin Yin

  KEYWORDS: Cu-Mg Alloy; Microstructural Evolution; Conform; Dynamic Recrystallization

  JOURNAL NAME: International Journal of Nonferrous Metallurgy, Vol.2 No.3, July 3, 2013

  ABSTRACT: The objective of this study is to investigate the possibility of continuous extrusion forming (Conform process) and microstructural evolution the of Cu-Mg alloy. The results indicate that Conform process can break as-cast grains and refine the structure, meanwhile. This process can improve the degree of the structure homogeneity. The TEM and EBSD techniques were used to investigate the morphology, grain size and misorientation of the samples at cavity entrance and cavity export. Refined structures after shear deformation include broken grains and subgrains formed by dislocation reconstruction. Due to the relatively high deformation temperature, dynamic recrystallization occurred during deformation. The subgrain rotation nucleation took place, and grain boundary migration resulted in grain growth. However, the coarse grains were refined by anneal twins.