TITLE:
Air Cooling of Mini-Channel Heat Sink in Electronic Devices
AUTHORS:
Mousa M. Mohamed, Mostafa A. Abd El-Baky
KEYWORDS:
Mini-Channel Heat Sink; Channel Air Cooling; Electronic Cooling; Fin Approach
JOURNAL NAME:
Journal of Electronics Cooling and Thermal Control,
Vol.3 No.2,
June
14,
2013
ABSTRACT: Heat transfer experiments were conducted to investigate the thermal performance of air cooling through mini-channel heat sink with various configurations. Two types of channels have been used, one has a rectangular cross section area of 5 × 18 mm2 and the other is triangular with dimension of 5 × 9 mm2. Four channels of each configuration have been etched on copper block of 40 mm width,30 mm height, and 200 mm length. The measurements were performed in steady state with air flow rates of 0.002 - 0.005 m3/s, heating powers of 80 - 200 W and channel base temperatures of 48°C, 51°C, 55°C and 60°C. The results showed that the heat transfer to air stream is increased with increasing both of air mass flow rate and channel base temperature. The rectangular channels have better thermal performance than trian- gular ones at the same conditions. Analytical fin approach of 1-D and 2-D model were used to predict the heat transfer rate and outlet air temperature from channels heat sink. Theoretical results have been compared with experimental data. The predicted values for outlet air temperatures using the two models agree well with a deviation less than ±10%. But for the heat transfer data, the deviation is about +30% to –60% for 1-D model, and –5% to –80% for 2-D model. The global Nusselt number of the present experimental data is empirically correlated as with accuracy of ±20% for and compared with other literature correlations.