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S.-D. Kim, I.-S. Hwang, H.-M. Park, J.-K. Rhee, C.-W. Nam, “Chemical Mechanical Polishing of Shallow Trench Isolation Using the Ceria-Based High Selectivity Slurry for Sub-0.18 μm Complementary Metal Oxide Semiconductor Fabrication,” Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, Vol. 20, No. 3, 2002, pp. 918-923. doi:10.1116/1.1475984

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