TITLE:
Three-Dimensional Stress Concentration Factor in Finite Width Plates with a Circular Hole
AUTHORS:
Murilo Augusto Vaz, Julio Cesar Ramalho Cyrino, Gilson Gomes da Silva
KEYWORDS:
Stress Concentration Factor; Plates with Circular Hole; Finite Element Analysis
JOURNAL NAME:
World Journal of Mechanics,
Vol.3 No.3,
June
4,
2013
ABSTRACT: The
three-dimensional stress concentration factor (SCF) at the edge of elliptical
and circular holes in infinite plates under remote tension has been extensively investigated considering
the variations of plate thickness, hole dimensions and material properties,
such as the Poisson’s coefficient. This study employs three dimensional finite
element modeling to numerically investigate the effect of plate width on the
behavior of the SCF across the thickness of linear elastic isotropic plates with a
through-the-thickness circular hole under remote tension. The problem is
governed by two geometric
non-dimensional parameters, i.e., the
plate half-width to hole radius (W/r) and the plate thickness to hole
radius (B/r) ratios. It is shown that for thin plates
the value of the SCF is nearly constant throughout the thickness for any plate
width. As the plate thickness increases, the point of maximum SCF shifts from
the plate middle plane and approaches
the free surface. When the ratio of plate half-width to hole radius (W/r) is greater than four,
the maximum SCF was observed to approximate the theoretical value determined
for infinite plates. When the plate width is reduced, the maximum SCF values
significantly increase. A polynomial curve fitting was employed on the
numerical results to generate empirical formulas for the maximum and surface
SCFs as a function of W/r and B/r. These equations can be applied,
with reasonable accuracy, to practical problems of structural strength and
fatigue, for instance.