Article citationsMore>>

K. M. Chang, T. H. Yeh, I. C. Deng and C. W. Shih, “Amorphouslike Chemical Vapor Deposited Tungsten Diffusion Barrier for Copper Metallization and Effects of Nitrogen Addition,” Journal of Applied Physics, Vol. 82, No. 3, 1997, pp. 1469-1475. doi:10.1063/1.365925

has been cited by the following article:

SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top