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K. A. Bowman, S. G. Duvall and J. D. Meindl, “Impact of Die-to-Die and Within-Die Parameter Fluctuations on the Maximum Clock Frequency Distribution for Gigascale Integration,” IEEE Journal of Solid-State Circuits, Vol. 37, No. 2, 2002, pp. 183-190. doi:10.1109/4.982424

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