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H. M. Veit, A. M. Bernardes, J. Z. Ferreira, J. A. S. Tenorio and C. D. Malfatti, “Recovery of Copper from Printed Circuit Boards Scraps by Mechanical Processing and Electrometallurgy,” Journal of Hazardous Materials, Vol. 137, No. 3, 2006, pp. 1704-1709. doi:10.1016/j.jhazmat.2006.05.010

has been cited by the following article:

• TITLE: Banana Peel Carbon that Containing Functional Groups Applied to the Selective Adsorption of Au(III) from Waste Printed Circuit Boards

  AUTHORS: Huajun Zheng, Limin Wang

  KEYWORDS: Banana Peel Carbon; Adsorption; Gold(III); Printed Circuit Boards

  JOURNAL NAME: Soft Nanoscience Letters, Vol.3 No.2, April 11, 2013

  ABSTRACT: This paper reports a kind of banana peel carbon (BPC) containing -OH, -NH2 functional groups which prepared through controlling carbonization temperature and its application on the selective adsorption of gold from waste printed circuit boards (PCBs). The adsorption of BPC for Au(III) reached equilibrium in 30 min and the adsorption of Au(III) was favorable at pH 2.5. Meanwhile, the adsorption isotherm showed the maximum adsorption capacity of 801.7 mg/g for Au(III). The results displayed that BPC had a strong selectivity for Au(III) and a negligible affinity to base metal ions, such as Cu(II), Ni(II), Fe(III) and Pb(II). The BPC adsorbent, which absorbed gold, can be recovered completely by HCl-thiourea solution.