Article citationsMore>>

P. J. Yang and J. S. Temenoff, “Engineering Orthopedic Tissue Interfaces,” Tissue Engineering—Part B: Reviews, Vol. 15, No. 2, 2009, pp. 127-141.

has been cited by the following article:

• TITLE: Electrochemical Bioencapsulation of Nanomaterials into Collagen for Biomedical Applications

  AUTHORS: Xingguo Cheng, Vasiliki Poenitzsch, Lauren Cornell, Christopher Tsao, Thomas Potter

  KEYWORDS: Nanomaterials; Electrochemical; Bioencapsulation; Collagen; Biomedical Applications

  JOURNAL NAME: Journal of Encapsulation and Adsorption Sciences, Vol.3 No.1, March 29, 2013

  ABSTRACT: Here we reported a novel electrochemical encapsulation method to encapsulate various nanomaterials and bimolecules into collagen. The electrochemical encapsulation process involves assembling of collagen along with Nano/bio materials using an isoelectric focusing mechanism. We have showed that a wide range of Nanomaterials such as carbon nanotubes, polymeric nanoparticles, magnetic calcium phosphate nanoparticlesand biomolecules can be encapsulated into collagen. These novel collagen-based composite materials possess improved electric, mechanical, antimicrobial, magnetic, bioactive properties. Thus, this novel electrochemical encapsulation process offers a means to fabricate novel biomaterials for various biomedical applications such as tendon/ligament, nerve, skin tissue engineering, tendon/ligament to bone grafts, and sutures, etc.