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X. G. Cheng and S. Desai, “Preparation of Nanoparticle Containing Aligned Collagen Fibers for Dense Connective Tissue Repair and Regeneration,” MRS Conference Proceedings, Cambridge Journals Online, Vol. 1417, 2012, p. 5.

has been cited by the following article:

• TITLE: Electrochemical Bioencapsulation of Nanomaterials into Collagen for Biomedical Applications

  AUTHORS: Xingguo Cheng, Vasiliki Poenitzsch, Lauren Cornell, Christopher Tsao, Thomas Potter

  KEYWORDS: Nanomaterials; Electrochemical; Bioencapsulation; Collagen; Biomedical Applications

  JOURNAL NAME: Journal of Encapsulation and Adsorption Sciences, Vol.3 No.1, March 29, 2013

  ABSTRACT: Here we reported a novel electrochemical encapsulation method to encapsulate various nanomaterials and bimolecules into collagen. The electrochemical encapsulation process involves assembling of collagen along with Nano/bio materials using an isoelectric focusing mechanism. We have showed that a wide range of Nanomaterials such as carbon nanotubes, polymeric nanoparticles, magnetic calcium phosphate nanoparticlesand biomolecules can be encapsulated into collagen. These novel collagen-based composite materials possess improved electric, mechanical, antimicrobial, magnetic, bioactive properties. Thus, this novel electrochemical encapsulation process offers a means to fabricate novel biomaterials for various biomedical applications such as tendon/ligament, nerve, skin tissue engineering, tendon/ligament to bone grafts, and sutures, etc.