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A. C. Mishra, “Microstructure, Magnetic and Magnetoimpedance Properties in Electrodeposited NiFe/Cu and CoNiFe/Cu Wire with Thiourea Additive in Plating Bath,” Physica B: Condensed Matter, Vol. 407, No. 6, 2012, pp. 923-934. doi:10.1016/j.physb.2011.11.033

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