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V. Srivastava, K. R. McNee, H. Jones and G. W. Greenwood, “The Effect of Low Stresses on Creep and Surfaces Profiles of Thin Copper Wires,” Acta Materialia, Vol. 51, No. 15, 2003, pp. 4611-4619. doi:10.1016/S1359-6454(03)00298-2

has been cited by the following article:

• TITLE: Effect of Prior-Heat Treatments on the Creep Behavior of an Industrial Drawn Copper

  AUTHORS: Zakaria Boumerzoug, Salim Gareh, Abdellatif Beribeche

  KEYWORDS: Copper; Creep; Drawn Wire; Heat Treatment

  JOURNAL NAME: World Journal of Condensed Matter Physics, Vol.2 No.4, November 29, 2012

  ABSTRACT: The effect of prior-heat treatments at 500℃, 600℃ and 700℃ on the creep behavior of an industrial drawn copper has been studied under constant stresses (98, 108 and 118 MPa) and temperatures (290℃ and 340℃). The results revealed that the creep behavior and the creep life of the material depend strongly on these prior-heat treatments. The apparent activation energy Qc for different creep tests of a drawn copper wire was calculated. The fracture mechanism of the material is characterized using optical microscopy.