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P. A. Thorsen and J. B. Sorensen, “Deposition of Material at Grain Boundaries in Tension Interpreted in Terms of Diffusional Creep,” Materials Science and Engineering: A, Vol. 265, No. 1-2, 1999, pp. 140-145. doi:10.1016/S0921-5093(98)01139-3

has been cited by the following article:

• TITLE: Effect of Prior-Heat Treatments on the Creep Behavior of an Industrial Drawn Copper

  AUTHORS: Zakaria Boumerzoug, Salim Gareh, Abdellatif Beribeche

  KEYWORDS: Copper; Creep; Drawn Wire; Heat Treatment

  JOURNAL NAME: World Journal of Condensed Matter Physics, Vol.2 No.4, November 29, 2012

  ABSTRACT: The effect of prior-heat treatments at 500℃, 600℃ and 700℃ on the creep behavior of an industrial drawn copper has been studied under constant stresses (98, 108 and 118 MPa) and temperatures (290℃ and 340℃). The results revealed that the creep behavior and the creep life of the material depend strongly on these prior-heat treatments. The apparent activation energy Qc for different creep tests of a drawn copper wire was calculated. The fracture mechanism of the material is characterized using optical microscopy.