Article citationsMore>>

K. Mistry, et al., “A 45 nm Logic Technology with High-k + Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193 nm Dry Patterning, and 100% Pb-Free Packaging,” International Electron Devices Meeting Technical Digest, Washington DC, 10-12 December 2007, pp. 247-250.

has been cited by the following article:

SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top