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S. Li, K. W. Gao, L. J. Qiao, F. X. Zhou and W. Y. Chu, “Molecular Dynamics Simulation of Microcrack Healing in Copper,” Computational Materials Science, Vol. 20, No. 2, 2001, pp. 143-150. doi:10.1016/S0927-0256(00)00130-0

has been cited by the following article:

• TITLE: Evolution of Internal Crack in BCC Fe under Compressive Loading

  AUTHORS: Dongbin Wei, Zhengyi Jiang, Jingtao Han

  KEYWORDS: Internal Crack; Evolution; BCC Fe; Simulation; Compressive Load

  JOURNAL NAME: Journal of Modern Physics, Vol.3 No.10, October 31, 2012

  ABSTRACT: A molecular dynamics model has been developed to investigate the evolution of the internal crack of nano scale during heating or compressive loading in BCC Fe. The initial configuration does not contain any pre-existing dislocations. In the case of heating, temperature shows a significant effect on crack evolution and the critical temperature at which the crack healing becomes possible is 673 K. In the case of compressive loading, the crack can be healed at 40 K at a loading rate 0.025 × 1018 Pa·m1/2/s in 6 × 10-12 s. The diffusion of Fe atoms into the crack area results in the healing process. However, dislocations and voids appear during healing and their positions change continuously.