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H. J. Jiang, K. Moon and C. P. Wong, “Synthesis of Ag-Cu Alloy Nanoparticles for Lead-Free Interconnect Materials,” Proceedings of International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, 16-18 March 2005, pp. 173-177. doi:10.1109/ISAPM.2005.1432072

has been cited by the following article:

• TITLE: Low Temperature Formation of Silver and Silver-Copper Alloy Nano-Particles Using Plasma Enhanced Hydrogenation and Their Optical Properties

  AUTHORS: Zeinab Kiani, Yaser Abdi, Ezatollah Arzi

  KEYWORDS: Nanoparticles; Plasma; Hydrogen; PECVD; Silver; Alloy

  JOURNAL NAME: World Journal of Nano Science and Engineering, Vol.2 No.3, September 28, 2012

  ABSTRACT: In this paper, a novel method of producing nanoparticles at low temperatures using hydrogen bombardment of thin films, deposited on glass substrates, is introduced. Silver nanoparticles were obtained by this method in our Plasma Enhanced Chemical Vapor Deposition system. Optical and morphological characteristics of these nanoparticles were extensively studied for various conditions of plasma treatment, such as plasma power density, temperature, duration of hydrogen bombardment, thickness of the initial thin metallic film etc. In addition, Ag-Cu alloy nanoparticles on glass substrates were also achieved. The process of nanoparticle formation in this method shows that several kinds of metals and semiconductors nanoparticles can be obtained using this approach. Scanning Electron Microscopy, Atomic Force Microscopy and Transmission Electron Microscopy were used to analyze the nanostructures.