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T. Ohji, A. Nakahira, T. Hirano and K. Niihara, “Tensile Creep Behavior of Aalumina/Silicon Carbide Nanocomposites,” Journal of the American Ceramic Society, Vol. 77, No. 12, 1994, pp. 3259-3262. doi:10.1111/j.1151-2916.1994.tb04580.x

has been cited by the following article:

• TITLE: Fabrication of Sintered Diamond/Metal Composites and Evaluation of Grinding Performance for Sapphire

  AUTHORS: Makoto Inoue, Kenta Yasuda, Tadashi Ito, Tetsu Sasahara, Masaru Yokota, Atsushi Nakahira

  KEYWORDS: Diamond; Composite; Brazing; Ag; Microstructure; Grinding

  JOURNAL NAME: Materials Sciences and Applications, Vol.3 No.9, September 27, 2012

  ABSTRACT: The fabrication of sintered diamond/metal composites bodies composed of diamond filler with the average particle size of 15 μm to 30 μm and metal binder (Ag-Cu-Ti system brazing) was attempted by powder metallurgical sintering process at 700℃ to 1000?C in vacuum atmosphere. As a result, dense bulks of sintered diamond/metal composites were obtained by this powder metallurgical sintering process. The increase of sintering temperatures from 750℃ to 950℃ and of pressure enhanced the density of sintered diamond/metal composites during the hot-pressing in vacuum. All bulks prepared at the temperatures of 750?C to 950℃ were composed of diamond phase and Ag-Cu-Ti system brazing without any other phase for sintered bulks for diamond/metal composites. Furthermore, some properties were evaluated for sintered diamond/metal composites.