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R. R. Tummala, V. Sudaram, F. Liu, G. White, S. Bhattacharya, R. M. Pulugurtha, M. Swaminathan, J. Laskar, N. M. Jokerst and S. Y. Chow, “High Density Packaging in 2010 and Beyond,” IEEE International Symposium on Electronic Materials and Packaging, Taiwan, 2002, pp. 30-36.

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