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L. Yuan, S. Liu, M. Chen and X. Luo, “Thermal Analysis of High Power LED Array Packaging with Microchannel Cooler,” 7th International Conference on Electronic Packaging Technology (ICEPT '06), Shanghai, 2006, pp. 1-5.

has been cited by the following article:

• TITLE: A Cooling System with a Fan for Thermal Management of High-Power LEDs

  AUTHORS: Ruishan Wang, Junhui Li

  KEYWORDS: High-Power Leds, Cooling System, Heat Dissipation, The Fan, Data Acquisition Card

  JOURNAL NAME: Journal of Modern Physics, Vol.1 No.3, September 8, 2010

  ABSTRACT: To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature is 26ºC. Results show that the temperature of the substrate of LEDs reaches 62ºC without the fan, however, it reaches only 32ºC when the best cooling condition appears. The temperature of the LEDs decreases by 30ºC since the heat produced by LEDs is transferred rapidly by the fan. The experiment demonstrates that the cooling system with the fan has good performance.