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S. Hu, Y. Xiong, L. Wang, R. Li, J. Shi and T. Lim, “Compact High-Gain mmWave Antenna for TSV-Based System-in-Package Application,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No. 5, 2012, pp. 841-846. doi:10.1109/TCPMT.2012.2188293

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