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M. Li, H. Xu, S.-W. R. Lee, J. Kim and D. Kim, “Eddy Current Induced Heating for the Soldering Reflow of Area Array Packages,” IEEE Transactions on Advanced Packaging, Vol. 2, No. 31, 2008, pp. 399-403. doi:10.1109/TADVP.2008.923385

has been cited by the following article:

• TITLE: High-Frequency Heating for Soldering in Electronics

  AUTHORS: Vladimir L. Lanin

  KEYWORDS: HF Heating; Inductor; Soldering; Electronic Modules

  JOURNAL NAME: Circuits and Systems, Vol.3 No.3, June 25, 2012

  ABSTRACT: Processes of high-frequency (HF) heating are examined and its parameters for the soldering of electronic modules are optimized. The advantages of HF heating are the following: selectivity by skin-effect; high density of energy; process- ing in any environment, including vacuum or inert gas; high ecological cleanliness, improvement solder flowing by electrodynamics forces increase the quality of soldering connections. Investigation of HF electromagnetic heating has allowed to optimize heating speed in local zones of soldering connections formation and to improve their quality due to joint action of superficial effects and electromagnetic forces.