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R. Venkatasubramanian, E. Siivola, T. Colpitts, B. O’Quinn, “Thin-Film Thermoelectric Devices with High Room- Temperature Figures of Merit,” Nature, Vol. 413, 2001, pp. 597-602. doi:10.1038/35098012

has been cited by the following article:

• TITLE: Electrodeposition of Bi-Sb alloy using Cu electrodes

  AUTHORS: Masato Ohmukai, Akira Tsuyoshi

  KEYWORDS: Electrodeposition; EPMA; XRD; Compound Semiconductors; Thermal Electric Generation

  JOURNAL NAME: Materials Sciences and Applications, Vol.3 No.7, July 19, 2012

  ABSTRACT: Bi-Sb alloys were grown by means of an electrodeposition method using Cu electrodes. The alloys were studied with the help of an x-ray diffractometer and an electron probe microanalysis. The both investigations have shown no trace of Cu in the obtained alloys. It can be concluded that Cu electrodes can be used for the deposition of Bi-Sb alloys; which results in an advantage of availability of the electrode.