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Bujard P., Kuhnlein G., Ino S. and Shiobara, 1994, “Thermal conductivity of molding compounds for plastic packaging.” IEEE Transactions on Components Packaging and Manufacturing Technologies Part A, Vol. 17, No. 4, pp. 527–532.

has been cited by the following article:

• TITLE: Preparation and Characterization of Electrically and Thermally Conductive Polymeric Nanocomposites

  AUTHORS: Mousam Choudhury, Smita Mohanty, Sanjay K Nayak, Rakesh Aphale

  KEYWORDS: Epoxy; Micro-AlN; Nano-AlN; Insulation; Electrical Properties; Resistivity

  JOURNAL NAME: Journal of Minerals and Materials Characterization and Engineering, Vol.11 No.7, July 25, 2012

  ABSTRACT: The dielectric properties of composites and nanocomposites composed of epoxy resin as base matrix and AlN (Aluminum Nitride) as micro and nanofiller has been studied at variable loading of AlN. To improve the dispersion of the filler within the polymer matrix, AlN was surface modified with silane coupling agent (SCA). The thermal conductivity behavior of epoxy/AlN composites and nanocomposites has been studied at variable percentage of filler and temperatures. Test result indicated an increase of thermal conductivity of the composites at 20 wt% of AlN. Also, silane treated composites exhibited improved electrical conductivity properties wherein the electrical insulation property decreased in terms of di-electric strength and resistivity.