Article citationsMore>>

C. P. Wong and R. S. Bollampally, “Thermal Conductivity, Elastic Modulus, and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging,” Journal of Applied Polymer Science, Vol. 74, No. 14, pp. 3396-3403. doi:10.1002/(SICI)1097-4628(19991227)74:14<3396::AID-APP13>3.0.CO;2-3

has been cited by the following article:

• TITLE: Effect of Geometry of Filler Particles on the Effective Thermal Conductivity of Two-Phase Systems

  AUTHORS: Deepti Chauhan, Nilima Singhvi, Ramvir Singh

  KEYWORDS: Effective Thermal Conductivity; Polymer Composites; Minimal Thermal Resistance; Shape of Filler

  JOURNAL NAME: International Journal of Modern Nonlinear Theory and Application, Vol.1 No.2, June 28, 2012

  ABSTRACT: The present paper deals with the effect of geometry of filler particles on the effective thermal conductivity for polymer composites. In the earlier models, less emphasis has been given on the shape of filler particles. In this paper, expressions for effective thermal conductivity has been derived using the law of minimal thermal resistance and equal law of the specific equivalent thermal conductivity for three different shapes i.e. spherical, elliptical and hexagonal of filler particles respectively. Calculated values of effective thermal conductivity for various samples using the derived expressions then compared with experimental data available and other models developed in the literature. The results calculated are in good agreement with the earlier experimental data and the deviation, is least in our expressions showing the success of the model.