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H. L. Lai and J. G. Duh, “Lead-Free Sn-Ag and Sn-Ag-Bi Solder Powders Prepared by Mechanical Alloying,” Journal of Electronic Materials, Vol. 32, No. 4, 2003, pp. 215-220. doi:10.1007/s11664-003-0212-1

has been cited by the following article:

• TITLE: Effect of Antimony Additions on Corrosion and Mechanical Properties of Sn-Bi Eutectic Lead-Free Solder Alloy

  AUTHORS: Alberto Torres, Luis Hernández, Octavio Domínguez

  KEYWORDS: Lead Free Solder Alloys; Sn-Bi-Sb; Mechanical Properties; Corrosion Properties

  JOURNAL NAME: Materials Sciences and Applications, Vol.3 No.6, June 18, 2012

  ABSTRACT: The goal of the present work is to investigate the effects of the addition of Sb (0, 3 and 6 wt%) on structure, melting, corrosion and mechanical properties of Sn-Bi eutectic solder alloys. The mechanical properties of the bulk Sn-Bi-Sb solders were higher as the amount of antimony increases, making compressive strength augment from 65 MPa to 100 MPa when 6 wt% Sb was incorporated to the Sn-Bi eutectic alloy. The three alloys presented a melting temperature that is smaller to the one exhibited by the eutectic alloy Sn-38Pb (Tm = 183°C). According to the electrochemical results, the addition of higher contents of Sb to the Sn-Bi eutectic alloy had a positive effect: it ennobled the Ecorr values.