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Y. Gu and T. Nakamura, “Interfacial Delamination and Fatigue Life Estimation of 3D Solder Bumps in Flip-Chip Packages,” Microelectronics Reliability, Vol. 44, No. 3, 2004, pp. 471-483. doi:10.1016/j.microrel.2003.11.002

has been cited by the following article:

• TITLE: Thermal Fatigue Life Estimation and Fracture Mechanics Studies of Multilayered MEMS Structures Using a Sub-Domain Approach

  AUTHORS: A. R. Maligno, D. C. Whalley, V. V. Silberschmidt

  KEYWORDS: Sub-Domain; FEM; Thermal Fatigue; Adaptive Remeshing

  JOURNAL NAME: World Journal of Mechanics, Vol.2 No.2, April 26, 2012

  ABSTRACT: This paper is concerned with the application of a Physics of Failure (PoF) methodology to assessing the reliability of Micro-Electro-Mechanical-System (MEMS) switches. Numerical simulations, based on the finite element method (FEM) using a sub-domain approach, were performed to examine the damage onset (e.g. yielding) due to temperature variations and to simulated the crack propagation different kind of loading conditions and, in particular, thermal fatigue. In this work remeshing techniques were employed in order to understand the evolution of initial flaws due, for instance, to manufacturing processes or originated after thermal fatigue.