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S.-L. Lee, J.-K. Chang, Y.-C. Cheng, K.-Y. Lee and W.-C. Chen, “Effects of Scandium Addi-tion on Electrical Resistivity and Formation of Thermal Hillocks in Aluminum Thin Films,” Thin Solid Films, Vol. 519, No. 11, 2011, pp. 3578-3581. doi:10.1016/j.tsf.2011.01.272
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