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You, Y., Kong, L., Xu, J., Xu, B., Liu, G. and Yang, B. (2021) Prediction of Activities of All Components in Sn-Ag-Cu and Sn-Ag-Cu-Zn Lead-Free Solders Using Modified Molecular Interaction Volume Model. Results in Chemistry, 3, Article ID: 100143.
https://doi.org/10.1016/j.rechem.2021.100143

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