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Hakamada, M., Nakamoto, Y., Matsumoto, H., Iwasaki, H., Chen, Y., Kusuda, H., et al. (2007) Relationship between Hardness and Grain Size in Electrodeposited Copper Films. Materials Science and Engineering: A, 457, 120-126.
https://doi.org/10.1016/j.msea.2006.12.101

has been cited by the following article:

• TITLE: Synthesis and Characterization of Cu-Co-Mn Alloys for Aeronautic Applications: Microstructural and Mechanical Performance

  AUTHORS: Rene Guardia-Tapia, Juan Antonio Ruiz-Ochoa, Isai Rosales-Cadena

  KEYWORDS: Structural Alloys, Hardness, Mechanical Properties, Wear

  JOURNAL NAME: Materials Sciences and Applications, Vol.17 No.4, April 2, 2026

  ABSTRACT: Cu-Co alloys with different manganese contents, were synthetized using the induction melting technique. Thermal treatments were applied to the resultant alloys, obtaining minimum superficial porosity. Scanning electron microscopy reveals a copper rich matrix and a secondary phase constituted of Mn-Co with precipitates mainly thorough the grain boundaries. Hardness evaluation shows average values for samples thermal treated of 138 HV which represent 12% lower than untreated samples, produced by the homogenization of the microstructure. Tribological analyses indicated that samples thermal treated have reached a noticeable increment in their wear resistance under an oxidative wear mechanism which make it as a promissory alloy for aeronautical applications.