Article citationsMore>>

Mohr-Weidenfeller, L., Kleinholz, C., Müller, B., Gropp, S., Günther-Müller, S., Fischer, M., et al. (2022) Thermal Analysis of the Ceramic Material and Evaluation of the Bonding Behavior of Silicon-Ceramic Composite Substrates. Journal of Micromechanics and Microengineering, 32, Article 105004.
https://doi.org/10.1088/1361-6439/ac8686

has been cited by the following article:

SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top