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Qin, Y., Albano, B., Spencer, J., Lundh, J.S., Wang, B., Buttay, C., et al. (2023) Thermal Management and Packaging of Wide and Ultra-Wide Bandgap Power Devices: A Review and Perspective. Journal of Physics D: Applied Physics, 56, Article 093001.
https://doi.org/10.1088/1361-6463/acb4ff

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