Article citationsMore>>

Haque, A., Lim, B.H., Haseeb, A.S.M.A. and Masjuki, H.H. (2011) Die Attach Properties of Zn-Al-Mg-Ga Based High-Temperature Lead-Free Solder on Cu Lead-frame. Journal of Materials Science: Materials in Electronics, 23, 115-123.
https://doi.org/10.1007/s10854-011-0511-x

has been cited by the following article:

SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top