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Lee, J., Kim, K., Suganuma, K., Takenaka, J. and Hagio, K. (2005) Interfacial Properties of Zn-Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate. Materials Transactions, 46, 2413-2418.
https://doi.org/10.2320/matertrans.46.2413

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