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Kim, Y.M., Oh, C., Roh, H. and Kim, Y. (2009) A New Cu-Zn Solder Wetting Layer for Improved Impact Reliability. 2009 59th Electronic Components and Technology Conference, San Diego, 26-29 May 2009, 1008-1013.
https://doi.org/10.1109/ectc.2009.5074135

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