Article citationsMore>>

Yamada, Y., Takaku, Y., Yagi, Y., Nakagawa, I., Atsumi, T., Shirai, M., et al. (2007) Reliability of Wire-Bonding and Solder Joint for High Temperature Operation of Power Semiconductor Device. Microelectronics Reliability, 47, 2147-2151.
https://doi.org/10.1016/j.microrel.2007.07.102

has been cited by the following article:

SCIRP Newsletter
Copyright © 2006-2026 Scientific Research Publishing Inc. All Rights Reserved.
Top