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Takaku, Y., Felicia, L., Ohnuma, I., Kainuma, R. and Ishida, K. (2007) Interfacial Reaction between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders. Journal of Electronic Materials, 37, 314-323.
https://doi.org/10.1007/s11664-007-0344-9

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