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Bansal, D.G. and Streator, J.L. (2009) Behavior of Copper-Aluminum Tribological Pair under High Current Densities. IEEE Transactions on Magnetics, 45, 244-249. https://doi.org/10.1109/tmag.2008.2008684

has been cited by the following article:

• TITLE: Optimization Analysis of Sliding Electrical Contact Interface Based on Electromechanical Coupling

  AUTHORS: Pengfei Yue, Jiahe Ma, Ronghao Shi, Kexing Song

  KEYWORDS: Sliding Contact Interface, Electromagnetic Propulsion, Current Density Distribution, Finite Element Analysis

  JOURNAL NAME: Journal of Applied Mathematics and Physics, Vol.12 No.11, November 29, 2024

  ABSTRACT: This work addresses the critical issue of current density distribution in the sliding electrical contact interface based on electromechanical coupling, which is essential for minimizing damage and enhancing performance. Using electromechanical coupling analysis and finite element analysis (FEA), the effects of initial contact pressure, pulse current input, and armature speed on current density are examined. Key findings indicate that optimizing the convex rail and armature structures significantly reduces peak current density, improving uniformity and reducing damage. These optimizations enhance the efficiency, accuracy, and service life of sliding electrical contact interfaces, providing a theoretical foundation for designing more durable and efficient high-current-density applications.