TITLE:
Cooling High Power Dissipating Artificial Intelligence (AI) Chips Using Refrigerant
AUTHORS:
Waheeb Mukatash, Hussameddine Kabbani, Jochem Marc Massalt, Matthew Moscoso, Merari Mejia Robles, Tyler Yang, Charlie Nino
KEYWORDS:
Artificial Intelligence, Thermal Control, Server Systems, Vapor Compression Refrigeration Cycle, Server Cooling
JOURNAL NAME:
Journal of Electronics Cooling and Thermal Control,
Vol.13 No.2,
June
30,
2024
ABSTRACT: High power dissipating artificial intelligence (AI) chips require significant cooling to operate at maximum performance. Current trends regarding the integration of AI, as well as the power/cooling demands of high-performing server systems pose an immense thermal challenge for cooling. The use of refrigerants as a direct-to-chip cooling method is investigated as a potential cooling solution for cooling AI chips. Using a vapor compression refrigeration system (VCRS), the coolant temperature will be sub-ambient thereby increasing the total cooling capacity. Coupled with the implementation of a direct-to-chip boiler, using refrigerants to cool AI server systems can materialize as a potential solution for current AI server cooling demands. In this study, a comparison of 8 different refrigerants: R-134a, R-153a, R-717, R-508B, R-22, R-12, R-410a, and R-1234yf is analyzed for optimal performance. A control theoretical VCRS model is created to assess variable refrigerants under the same operational conditions. From this model, the coefficient of performance (COP), required mass flow rate of refrigerant, work required by the compressor, and overall heat transfer coefficient is determined for all 8 refrigerants. Lastly, a comprehensive analysis is provided to determine the most optimal refrigerants for cooling applications. R-717, commonly known as Ammonia, was found to have the highest COP value thus proving to be the optimal refrigerant for cooling AI chips and high-performing server applications.