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Al-Ezzi, A., Al-Bawee, A., Dawood, F. and Shehab, A.A. (2014) Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy. Journal of Electronic Materials, 48, 8089-8095.
https://doi.org/10.1007/s11664-019-07577-w

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