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Luo, T.B., Hu, A., Hu, J., Li, M. and Mao, D.L. (2012) Microstructure and Mechanical Properties of Sn-Zn-Bi-Cr Lead-Free Solder. Microelectronics Reliability, 52, 585-588.
https://doi.org/10.1016/j.microrel.2011.10.005

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