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Das, S.K., Sharif, A., Chan, Y.C., Wong, N.B. and Yung, W.K.C. (2009) Influence of Small Amount of Al and Cu on the Microstructure, Microhardness and Tensile Properties of Sn-9Zn Binary Eutectic Solder Alloy. Journal of Alloys and Compounds, 481, 167-172.
https://doi.org/10.1016/j.jallcom.2009.03.017

has been cited by the following article:

• TITLE: Mechanical and Electrical Properties of Some Sn-Zn Based Lead-Free Quinary Alloys

  AUTHORS: Shihab Uddin, Md. Abdul Gafur, Suraya Sabrin Soshi, Mohammad Obaidur Rahman

  KEYWORDS: Lead-Free Solder, Strain Rate, Ultimate Tensile Strength, Ductility, Electrical Conductivity

  JOURNAL NAME: Materials Sciences and Applications, Vol.15 No.7, July 22, 2024

  ABSTRACT: Although there are many lead-free soldering alloys on the market, none of them have ideal qualities. The researchers are combining binary alloys with a variety of additional materials to create the soldering alloys’ features. The eutectic Sn-9Zn alloy is among them. This paper investigated the mechanical and electrical properties of Sn-9Zn-x (Ag, Cu, Sb); {x = 0.2, 0.4, and 0.6} lead-free solder alloys. The mechanical properties such as elastic modulus, ultimate tensile strength (UTS), yield strength (YS), and ductility were examined at the strain rates in a range from 4.17 10−3 s−1 to 208.5 10−3 s−1 at room temperature. It is found that increasing the content of the alloying elements and strain rate increases the elastic modulus, ultimate tensile strength, and yield strength while the ductility decreases. The electrical conductivity of the alloys is found to be a little smaller than that of the Sn-9Zn eutectic alloy.