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Ventura, T., Terzi, S., Rappaz, M. and Dahle, A.K. (2011) Effects of Solidification Kinetics on Microstructure Formation in Binary Sn-Cu Solder Alloys. Acta Materialia, 59, 1651-1658.
https://doi.org/10.1016/j.actamat.2010.11.032

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