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Fouzder, T., Gain, A.K. and Chan, D.K. (2017) Microstructure, Wetting Characteristics and Hardness of Tin-Bismuth-Silver (Sn-Bi-Ag) Solders on Silver (Ag)-Surface Finished Copper (Cu) Substrates. Journal of Materials Science: Materials in Electronics, 28, 16921-16931.
https://doi.org/10.1007/s10854-017-7611-1

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