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Li, C.J., Yan, Y.F., Gao, T.T. and Xu, G.D. (2020) The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-XSb High-Temperature Lead-Free Solder. Materials, 13, Article 4443.
https://doi.org/10.3390/ma13194443

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