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Chen, W.X., Xue, S.B., Wang, H. and Hu, Y.H. (2010) Reliability Studies of Sn–9Zn/Cu and Sn–9Zn–0.3 Ag/Cu Soldered Joints with Aging Treatment. Journal of Materials Science: Materials in Electronics, 21, 779-786.
https://doi.org/10.1007/s10854-009-9993-1

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